Staff

M. Sc. Christopher Beck (Akad. Rat)

Contact

  • Mail:
  • Phone: 09131/85-27193
  • Fax: Neu:09131/85-28730
  • Room: 3.228
  • Cauerstraße 9
    91058 Erlangen

About Christopher Beck

    Christopher Beck studied electrical engineering from 2010 to 2015 at the University Erlangen-Nuremberg. Since 2015 he is employee at the chair of electronics engineering. Furthermore he is a licensed ham radio operator having the call DL1CHB.

Areas of Interest

  • RF chip design
  • Circuit Design for Radar Systems

Offered Thesis

    In case of interest, please contact me.

Running Thesis

  • Bachelor thesis Bianca Socher "Untersuchung von Messmethoden zur Charakterisierung von Alkanolen auf deren Hochfrequenzeigenschaften"
  • Masterarbeit Xianshi Zeng "Entwicklung eines schmalbandigen Datenübertragungsverfahrens für das 70cm Amaterufunkband"
  • Research Internship Josef Koller
  • Research Internship Jasmin Gabsteiger
  • Bachelor Thesis Gamze Köse, extern Siemens

Finished Thesis

  • FP Xianshi Zeng"Optimierung einer Messschaltung für die Impedanzspektroskopie von künstlichen Hautzellen"
  • Bachelor thesis Lena Krabbe "Aufbau und Evaluierung eines Open-Source-Impedanztomographiesystems"
  • Bachelor thesis Jasmin Gabsteiger "Entwicklung und Evaluation von HF-Komponenten im 3D-Druck" (09/2018)
  • Master thesis Sebastian Meyer "Entwicklung eines portablen Messsystems für die Impedanzspektroskopie von synthetischen, biologischen Geweben" (03/2018)
  • Bachelor's Thesis Florian Irnstorfer "Entwurf eines integrierten Quadraturmischers in 130nm SiGe BiCMOS Technologie" (10/2016)

HiWi-Jobs

    Jobs as a student employer (HiWi-Jobs) are possible as well. In case of interesst, please contact me.

Contacte me encrypted

    You can also write me an e-mail encrypted using GPG. My public-key-fingerprint is AE1A C931 2BAF C5A1 F0BE 2083 3117 1121 2F9D 4F14, which you can also get personally from me by meeting myself to verify it on your own without any use of the WoT.

Lectures Summer term 2019

Lectures Winter term 2019

Awards

  • C. Beck and D. Kissinger, GMM-Preis 2017, VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM), 2017. [Bibtex]
    @prize{beck_prize_2017,
    author = {Beck, Christopher and Kissinger, Dietmar},
    booktitle = {VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM)},
    cris = {beck_prize_2017},
    year = {2017},
    month = {10},
    day = {25},
    title = {GMM-Preis 2017},
    type = {20773-Kleiner Preis},
    }

COPYRIGHT NOTICE: Copyright and all rights of the material above are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by the appropriate copyright. The material may not be reposted without the explicit permission of the copyright holder.

COPYRIGHT NOTICE FOR IEEE PUBLICATIONS: © IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

COPYRIGHT NOTICE FOR EUMA PUBLICATIONS: © EUMA. Personal use of this material is permitted. Permission from European Microwave Association(EUMA) must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Publications

2019

  • J. Potschka, C. Söll, J. Kirchner, C. Mardin, M. Stadelmayer, T. Maiwald, S. Breun, K. Kolb, A. Bauch, M. Dietz, C. Beck, M. Völkel, A. Hagelauer, and R. Weigel, "Design of an Integrated Subretinal Implant Using Cellular Neural Networks for Binary Image Generation in a 130 nm BiCMOS Process" in IEEE Engineering in Medicine and Biology Conference (EMBC), Berlin, 2019. [Bibtex]
    @inproceedings{potschka2019,
    author = {Potschka, Julian and Söll, Christopher and Kirchner, Jens and Mardin, Christian and Stadelmayer, Markus and Maiwald, Tim and Breun, Sascha and Kolb, Katharina and Bauch, Andreas and Dietz, Marco and Beck, Christopher and Völkel, Matthias and Hagelauer, Amelie and Weigel, Robert},
    booktitle = {IEEE Engineering in Medicine and Biology Conference (EMBC)},
    cris = {https://cris.fau.de/converis/publicweb/publication/217754593},
    year = {2019},
    month = {07},
    day = {23},
    eventdate = {2019-07-23/2019-07-27},
    faupublication = {yes},
    peerreviewed = {Yes},
    title = {Design of an Integrated Subretinal Implant Using Cellular Neural Networks for Binary Image Generation in a 130 nm BiCMOS Process},
    type = {Konferenzschrift},
    venue = {Berlin},
    }

2016

  • C. Beck, H. J. Ng, R. Agethen, S. M. Pour Mousavi, H. Forstner, M. Wojnowski, K. Pressel, R. Weigel, A. Hagelauer, and D. Kissinger, "Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology", IEEE Sensors Journal, vol. 16, iss. 17, pp. 6566-6578, 2016. [DOI] [Bibtex]
    @article{beck2016,
    abstract = {We present highly integrated 60GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array (eWLB) technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8 × 8mm2 package. These frontends were soldered on a standard low-cost PCB based on FR4 material. For verification of the proposed frontends, an FMCW radar system was developed and set up within this work. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show excellent system performance at a high integration level.},
    author = {Beck, Christopher and Ng, Herman Jalli and Agethen, Roman and Pour Mousavi, Seyed Mehran and Forstner, Hans-Peter and Wojnowski, Maciej and Pressel, Klaus and Weigel, Robert and Hagelauer, Amelie and Kissinger, Dietmar},
    publisher = {IEEE},
    cris = {https://cris.fau.de/converis/publicweb/publication/123908884},
    year = {2016},
    month = {07},
    day = {07},
    doi = {10.1109/JSEN.2016.2587731},
    faupublication = {yes},
    issn = {1530-437X},
    journaltitle = {IEEE Sensors Journal},
    keywords = {SiGe RFICs; SiP modules; millimeter-wave circuits; packaging; radar systems},
    number = {17},
    pages = {6566--6578},
    peerreviewed = {Yes},
    shortjournal = {IEEE SENS J},
    title = {Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology},
    volume = {16},
    }
  • T. Girg, C. Beck, M. Dietz, A. Hagelauer, D. Kissinger, and R. Weigel, "A 180 GHz Frequency Multiplier in a 130 nm SiGe BiCMOS Technology" in 2016 IEEE 14th International NEWCAS Conference, Vancouver, 2016, pp. 1-4. [DOI] [Bibtex]
    @inproceedings{girg2016,
    abstract = {An integrated analog frequency multiplier for a novel high data rate communication system has been developed to multiply a 18 GHz input signal by ten to generate a 180 GHz output signal. With a first step the 18 GHz input signal is fed into a times five edge combiner, which generates an intermediate frequency of 90 GHz. Therefore five different phases with a delta of 72 degree are needed, that are provided by an active allpass filter chain. In a second step the 90 GHz intermediate frequency is given into a double-balanced Gilbert cell mixer. Here, frequency doubling is achieved by feeding the same signal into the LO and RF port of the mixer. Hence, the overall output frequency of 180 GHz results in 180 GHz with a simulated output power of -7 dBm. All simulations are done post-layout. The chip is implemented in a 130 nm BiCMOS technology with a chip area of 0.9 mm x 1 mm.},
    author = {Girg, Thomas and Beck, Christopher and Dietz, Marco and Hagelauer, Amelie and Kissinger, Dietmar and Weigel, Robert},
    publisher = {IEEE},
    booktitle = {2016 IEEE 14th International NEWCAS Conference},
    cris = {https://cris.fau.de/converis/publicweb/publication/108113324},
    year = {2016},
    month = {06},
    day = {26},
    doi = {10.1109/NEWCAS.2016.7604745},
    eventdate = {2016-06-26/2016-06-29},
    eventtitle = {2016 IEEE 14th International NEWCAS Conference},
    faupublication = {yes},
    keywords = {SiGe BiCMOS; high data rate communication; 180 GHz; simultaneous phase and amplitude regenerative sampling; transmitter; frequency multiplier},
    pages = {1--4},
    peerreviewed = {No},
    title = {A 180 GHz Frequency Multiplier in a 130 nm SiGe BiCMOS Technology},
    type = {Konferenzschrift},
    venue = {Vancouver},
    }

2015

  • D. Kissinger, T. Girg, C. Beck, I. Nasr, H. Forstner, M. Wojnowski, K. Pressel, and R. Weigel, "Integrated millimeter-wave transceiver concepts and technologies for wireless multi-Gbps communication" in IEEE MTT-S International Microwave Symposium, Phoenix, AZ, 2015, pp. 1-3. [DOI] [Bibtex]
    @inproceedings{kissinger2015a,
    author = {Kissinger, Dietmar and Girg, Thomas and Beck, Christopher and Nasr, Ismail and Forstner, Hans-Peter and Wojnowski, Maciej and Pressel, Klaus and Weigel, Robert},
    booktitle = {IEEE MTT-S International Microwave Symposium},
    cris = {https://cris.fau.de/converis/publicweb/publication/120737584},
    year = {2015},
    month = {05},
    doi = {10.1109/MWSYM.2015.7166712},
    faupublication = {yes},
    pages = {1--3},
    peerreviewed = {No},
    title = {Integrated millimeter-wave transceiver concepts and technologies for wireless multi-Gbps communication},
    type = {Konferenzschrift},
    venue = {Phoenix, AZ},
    }

COPYRIGHT NOTICE: Copyright and all rights of the material above are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by the appropriate copyright. The material may not be reposted without the explicit permission of the copyright holder.

COPYRIGHT NOTICE FOR IEEE PUBLICATIONS: © IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

COPYRIGHT NOTICE FOR EUMA PUBLICATIONS: © EUMA. Personal use of this material is permitted. Permission from European Microwave Association(EUMA) must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.