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M. Sc. Philipp Schmidbauer

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Publications

2018

  • P. Schmidbauer, M. Wojnowski, R. Weigel, and A. Hagelauer, "Concepts for a Monostatic Radar Transceiver Front-end in eWLB Package with Off-Chip Quasi-Circulator for 60 GHz" in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore, Singapore, 2018. [Bibtex]
    @inproceedings{schmidbauer2018a,
    author = {Schmidbauer, Philipp and Wojnowski, Maciej and Weigel, Robert and Hagelauer, Amelie},
    language = {English},
    booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)},
    cris = {https://cris.fau.de/converis/publicweb/publication/209907060},
    year = {2018},
    month = {12},
    day = {04},
    eventdate = {2018-12-04/2018-12-07},
    eventtitle = {20th Electronics Packaging Technology Conference (EPTC)},
    faupublication = {yes},
    peerreviewed = {unknown},
    title = {Concepts for a Monostatic Radar Transceiver Front-end in eWLB Package with Off-Chip Quasi-Circulator for 60 GHz},
    type = {Konferenzschrift},
    venue = {Singapore, Singapore},
    }
  • P. Schmidbauer, M. Wojnowski, R. Weigel, and A. Hagelauer, "Wafer Level Package Integrated Antenna Concepts for Circular Polarization" in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2018, pp. 285-287. [DOI] [Bibtex]
    @inproceedings{schmidbauer2018,
    abstract = {We prove design concepts for embedded wafer level ball grid array package integrated circularly polarized antennas in the 57 GHz to 64 GHz ISM band. Therefore, we propose performance requirements and evaluate the properties of four different antenna-in-package layouts based on electromagnetic full-wave simulations with focus on the axial ratio characteristics.},
    author = {Schmidbauer, Philipp and Wojnowski, Maciej and Weigel, Robert and Hagelauer, Amelie},
    editor = {IEEE},
    language = {English},
    booktitle = {2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
    cris = {https://cris.fau.de/converis/publicweb/publication/209731124},
    year = {2018},
    month = {10},
    day = {14},
    doi = {10.1109/EPEPS.2018.8534303},
    eventdate = {2018-10-14/2018-10-17},
    eventtitle = {27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
    faupublication = {yes},
    keywords = {ball grid arrays;electromagnetic wave polarisation;millimetre wave antennas;wafer level packaging;antenna-in-package layouts;ISM band;electromagnetic full-wave simulations;axial ratio characteristics;circularly polarized antennas;embedded wafer level ball grid array package;design concepts;circular polarization;wafer level package integrated antenna concepts;frequency 57 GHz to 64 GHz;Patch antennas;Bandwidth;Polarization;Antenna feeds;Layout;antenna-in-package;mm-wave packaging;heterogeneous integration},
    pages = {285--287},
    peerreviewed = {unknown},
    title = {Wafer Level Package Integrated Antenna Concepts for Circular Polarization},
    type = {Konferenzschrift},
    venue = {San Jose, CA, USA},
    }

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