Mitarbeiter

M. Sc. Christopher Beck (Akad. Rat)

Kontakt

  • E-Mail:
  • Telefon: 09131/85-27193
  • Fax: Neu:09131/85-28730
  • Raum: 02.081 E
  • Neu: Wetterkreuz 15
    91058 Erlangen

Über Christopher Beck

    Christopher Beck studierte von 2010 bis 2015 EEI an der Universität Erlangen-Nürnberg. Seit 2015 arbeitet er am Lehrstuhl für Technische Elektronik. Weiterhin ist er lizenzierter Funkamateur mit dem Rufzeichen DL1CHB.

Arbeitsgebiete

  • HF-Chipdesign
  • Schaltungstechnik für Radarsysteme

Abschlussarbeiten

    Falls Interesse besteht, kontaktiert mich einfach.
  • Forschungspraktikum "Machbarkeitsstudie emFAU - ein benutzerfreundlicher OpenSource 3DFeldsimulator"

Laufende Arbeiten

  • Forschungspraktikum Xianshi Zeng"Optimierung einer Messschaltung für die Impedanzspektroskopie von künstlichen Hautzellen"
  • Bachelorarbeit Bianca Socher "Untersuchung von Messmethoden zur Charakterisierung von Alkanolen auf deren Hochfrequenzeigenschaften"

Abgeschlossene Arbeiten

  • Bachelorarbeit Lena Krabbe "Aufbau und Evaluierung eines Open-Source-Impedanztomographiesystems" (10/2018)
  • Bachelorarbeit Jasmin Gabsteiger "Entwicklung und Evaluation von HF-Komponenten im 3D-Druck" (09/2018)
  • Masterarbeit Sebastian Meyer "Entwicklung eines portablen Messsystems für die Impedanzspektroskopie von synthetischen, biologischen Geweben" (03/2018)
  • Bachelorarbeit Florian Irnstorfer "Entwurf eines integrierten Quadraturmischers in 130nm SiGe BiCMOS Technologie" (10/2016)

HiWi-Jobs

    Jobs als studentische Hilfkraft (HiWi-Jobs) sind ebenfalls möglich. Sowohl in der Lehre (Tutortätigkeiten, Erweiterung des e-Learning-Angebots), als auch in den entsprechenden Forschungsgebieten. Falls Interesse besteht, meldet euch einfach bei mir.

Kontaktieren Sie mich verschlüsselt

    Sie können mir auch eine mit GPG verschlüsselte E-Mail schicken. Der Fingerabdruck meines Schlüssels ist AE1A C931 2BAF C5A1 F0BE 2083 3117 1121 2F9D 4F14, den Sie auch persönlich von mir erhalten können, sollten Sie mich treffen, um diesen neben dem WoT selbst zu verifizieren.

Lehrveranstaltungen Wintersemester 2018

Lehrveranstaltungen Sommersemester 2019

  • Praktikum zu High-Performance Analog- und Umsetzer-Design

  • Übungen zu Drahtlose Automobilelektronik

Preise & Auszeichnungen

  • C. Beck and D. Kissinger, GMM-Preis 2017, VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM), 2017. [Bibtex]
    @prize{beck_prize_2017,
    author = {Beck, Christopher and Kissinger, Dietmar},
    booktitle = {VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM)},
    cris = {beck_prize_2017},
    year = {2017},
    month = {10},
    day = {25},
    title = {GMM-Preis 2017},
    type = {20773-Kleiner Preis},
    }

COPYRIGHT NOTICE: Copyright and all rights of the material above are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by the appropriate copyright. The material may not be reposted without the explicit permission of the copyright holder.

COPYRIGHT NOTICE FOR IEEE PUBLICATIONS: © IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

COPYRIGHT NOTICE FOR EUMA PUBLICATIONS: © EUMA. Personal use of this material is permitted. Permission from European Microwave Association(EUMA) must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Publikationen

2016

  • C. Beck, H. J. Ng, R. Agethen, S. M. Pour Mousavi, H. Forstner, M. Wojnowski, K. Pressel, R. Weigel, A. Hagelauer, and D. Kissinger, "Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology", IEEE Sensors Journal, vol. 16, iss. 17, pp. 6566-6578, 2016. [DOI] [Bibtex]
    @article{beck2016,
    abstract = {We present highly integrated 60GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array (eWLB) technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8 × 8mm2 package. These frontends were soldered on a standard low-cost PCB based on FR4 material. For verification of the proposed frontends, an FMCW radar system was developed and set up within this work. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show excellent system performance at a high integration level.},
    author = {Beck, Christopher and Ng, Herman Jalli and Agethen, Roman and Pour Mousavi, Seyed Mehran and Forstner, Hans-Peter and Wojnowski, Maciej and Pressel, Klaus and Weigel, Robert and Hagelauer, Amelie and Kissinger, Dietmar},
    publisher = {IEEE},
    cris = {https://cris.fau.de/converis/publicweb/publication/123908884},
    year = {2016},
    month = {07},
    day = {07},
    doi = {10.1109/JSEN.2016.2587731},
    faupublication = {yes},
    issn = {1530-437X},
    journaltitle = {IEEE Sensors Journal},
    keywords = {SiGe RFICs; SiP modules; millimeter-wave circuits; packaging; radar systems},
    number = {17},
    pages = {6566--6578},
    peerreviewed = {Yes},
    shortjournal = {IEEE SENS J},
    title = {Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology},
    volume = {16},
    }
  • T. Girg, C. Beck, M. Dietz, A. Hagelauer, D. Kissinger, and R. Weigel, "A 180 GHz Frequency Multiplier in a 130 nm SiGe BiCMOS Technology" in 2016 IEEE 14th International NEWCAS Conference, Vancouver, 2016, pp. 1-4. [DOI] [Bibtex]
    @inproceedings{girg2016,
    abstract = {An integrated analog frequency multiplier for a novel high data rate communication system has been developed to multiply a 18 GHz input signal by ten to generate a 180 GHz output signal. With a first step the 18 GHz input signal is fed into a times five edge combiner, which generates an intermediate frequency of 90 GHz. Therefore five different phases with a delta of 72 degree are needed, that are provided by an active allpass filter chain. In a second step the 90 GHz intermediate frequency is given into a double-balanced Gilbert cell mixer. Here, frequency doubling is achieved by feeding the same signal into the LO and RF port of the mixer. Hence, the overall output frequency of 180 GHz results in 180 GHz with a simulated output power of -7 dBm. All simulations are done post-layout. The chip is implemented in a 130 nm BiCMOS technology with a chip area of 0.9 mm x 1 mm.},
    author = {Girg, Thomas and Beck, Christopher and Dietz, Marco and Hagelauer, Amelie and Kissinger, Dietmar and Weigel, Robert},
    publisher = {IEEE},
    booktitle = {2016 IEEE 14th International NEWCAS Conference},
    cris = {https://cris.fau.de/converis/publicweb/publication/108113324},
    year = {2016},
    month = {06},
    day = {26},
    doi = {10.1109/NEWCAS.2016.7604745},
    eventdate = {2016-06-26/2016-06-29},
    eventtitle = {2016 IEEE 14th International NEWCAS Conference},
    faupublication = {yes},
    keywords = {SiGe BiCMOS; high data rate communication; 180 GHz; simultaneous phase and amplitude regenerative sampling; transmitter; frequency multiplier},
    pages = {1--4},
    peerreviewed = {No},
    title = {A 180 GHz Frequency Multiplier in a 130 nm SiGe BiCMOS Technology},
    type = {Konferenzschrift},
    venue = {Vancouver},
    }

2015

  • D. Kissinger, T. Girg, C. Beck, I. Nasr, H. Forstner, M. Wojnowski, K. Pressel, and R. Weigel, "Integrated millimeter-wave transceiver concepts and technologies for wireless multi-Gbps communication" in IEEE MTT-S International Microwave Symposium, Phoenix, AZ, 2015, pp. 1-3. [DOI] [Bibtex]
    @inproceedings{kissinger2015a,
    author = {Kissinger, Dietmar and Girg, Thomas and Beck, Christopher and Nasr, Ismail and Forstner, Hans-Peter and Wojnowski, Maciej and Pressel, Klaus and Weigel, Robert},
    booktitle = {IEEE MTT-S International Microwave Symposium},
    cris = {https://cris.fau.de/converis/publicweb/publication/120737584},
    year = {2015},
    month = {05},
    doi = {10.1109/MWSYM.2015.7166712},
    faupublication = {yes},
    pages = {1--3},
    peerreviewed = {No},
    title = {Integrated millimeter-wave transceiver concepts and technologies for wireless multi-Gbps communication},
    type = {Konferenzschrift},
    venue = {Phoenix, AZ},
    }

COPYRIGHT NOTICE: Copyright and all rights of the material above are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by the appropriate copyright. The material may not be reposted without the explicit permission of the copyright holder.

COPYRIGHT NOTICE FOR IEEE PUBLICATIONS: © IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

COPYRIGHT NOTICE FOR EUMA PUBLICATIONS: © EUMA. Personal use of this material is permitted. Permission from European Microwave Association(EUMA) must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.